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  2. Metallic bonding - Wikipedia

    en.wikipedia.org/wiki/Metallic_bonding

    The strong bonding of metals in liquid form demonstrates that the energy of a metallic bond is not highly dependent on the direction of the bond; this lack of bond directionality is a direct consequence of electron delocalization, and is best understood in contrast to the directional bonding of covalent bonds.

  3. Bonding in solids - Wikipedia

    en.wikipedia.org/wiki/Bonding_in_solids

    Ionic bonding, which forms ionic solids; Metallic bonding, which forms metallic solids; Weak inter molecular bonding, which forms molecular solids (sometimes anomalously called "covalent solids") Typical members of these classes have distinctive electron distributions, [2] thermodynamic, electronic, and mechanical properties. In particular, the ...

  4. Sandwich compound - Wikipedia

    en.wikipedia.org/wiki/Sandwich_compound

    Structure of (Me 4 N +) 2 [Fe(C 2 B 9 H 11) 2] +, showing only one Me 4 N +. [4] Closely related are the metal complexes containing H 3 C 3 B 2 R 2 ligands. [7] In addition to these, other sandwich complexes containing purely inorganic ligands are known, such as Fe(C 5 Me 5)(P 5) and [(P 5) 2 Ti] 2−. [8]

  5. Chelation - Wikipedia

    en.wikipedia.org/wiki/Chelation

    Chelation (/ k iː ˈ l eɪ ʃ ən /) is a type of bonding of ions and their molecules to metal ions. It involves the formation or presence of two or more separate coordinate bonds between a polydentate (multiple bonded) ligand and a single central metal atom.

  6. Ligand field theory - Wikipedia

    en.wikipedia.org/wiki/Ligand_field_theory

    The greater stabilization that results from metal-to-ligand bonding is caused by the donation of negative charge away from the metal ion, towards the ligands. This allows the metal to accept the σ bonds more easily. The combination of ligand-to-metal σ-bonding and metal-to-ligand π-bonding is a synergic effect, as each enhances the other.

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  8. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    [1] [2] A weak bond can also be achieved at room temperature. [3] Diffusion bonding is usually implemented by applying high pressure, in conjunction with necessarily high temperature, to the materials to be welded; the technique is most commonly used to weld "sandwiches" of alternating layers of thin metal foil, and metal wires or filaments. [4]

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