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  2. Intel Core - Wikipedia

    en.wikipedia.org/wiki/Intel_Core

    Arrandale processors have integrated graphics capability. Core i3-3xx does not support for Turbo Boost, L3 cache in Core i5-5xx processors is reduced to 3 MB, while the Core i5-6xx uses the full cache, [46] Clarkdale is sold as Core i5-6xx, along with related Core i3 and Pentium processors. It has Hyper-Threading enabled and the full 4 MB L3 cache.

  3. List of Intel graphics processing units - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_graphics...

    Specifications of Intel HD Graphics series [24] Graphics Launch Market Processor Code name ... Core i5-11400 1300 UHD Graphics 750 Core i5-11500T 4C8A 256:32:4 1200 ...

  4. Alder Lake - Wikipedia

    en.wikipedia.org/wiki/Alder_Lake

    In April 2022, press reported on "hints" that Intel was working on Alder Lake-X. [14] [15] Intel officially announced the HX processor series on May 10, 2022, including Core i5, Core i7 and Core i9 models, [11] when Intel announced "seven new mobile processors for the 12th Gen Intel Core mobile family at its Intel Vision event. [16]

  5. Ivy Bridge (microarchitecture) - Wikipedia

    en.wikipedia.org/wiki/Ivy_Bridge_(microarchitecture)

    In 2011, Intel released the 7-series Panther Point chipsets with integrated USB 3.0 and SATA 3.0 to complement Ivy Bridge. [3] Volume production of Ivy Bridge chips began in the third quarter of 2011. [4] Quad-core and dual-core-mobile models launched on April 29, 2012 and May 31, 2012 respectively. [5]

  6. Comet Lake - Wikipedia

    en.wikipedia.org/wiki/Comet_Lake

    Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, [5] H-series mobile CPUs on April 2, 2020, [6] desktop Comet Lake-S CPUs April 30, 2020, [7] and Xeon W-1200 series workstation CPUs on May 13, 2020. [8] Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. [9]

  7. Raptor Lake - Wikipedia

    en.wikipedia.org/wiki/Raptor_Lake

    The processors are connected to PCHs using an OPIO 2.0 x8 interface, except for the HX series which uses a DMI 4.0 x8 interface. [29] Except for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors use 25x50mm BGA 1744, on a Type 3 or Type 4 HDI.