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The price had risen to $3,000 before eBay closed the auction. [8] [9] In May 2006, the remains of U.S. Fort Montgomery, a stone fortification in upstate New York built in 1844, were put up for auction on eBay. The first auction ended on June 5, 2006, with a winning bid of US$5,000,310.
In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
The heatspreader versions give the system designer greater latitude in thermally-enhanced board level and/or system design. RoHS compliant, lead-free and green material sets are now qualified standards. Leaded chip carrier extraction tool. Vacuum picks may also be used instead. A PLCC circuit may either be installed in a PLCC socket or surface ...
Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...
The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the package axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. [5]
A plastic dual-in-line package containing an analog integrated circuit.This can be installed in a socket or directly soldered to a printed circuit board. A low current thyristor and a high power device, with a threaded stud for attachment to a heat sink, and a flexible lead; such packages are used for devices rated for hundreds of amperes.
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Shrink plastic dual in-line package (SPDIP) – A denser version of the PDIP with a 0.07 in (1.778 mm) lead pitch. Skinny dual in-line package (SDIP or SPDIP [ 6 ] ) – Sometimes used to refer to a "narrow" 0.300 in. (or 300 mil ) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0. ...