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For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14 144
In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.
AWS A3.0:2001, Standard Welding Terms and Definitions Including Terms for Adhesive Bonding, Brazing, Soldering, Thermal Cutting, and Thermal Spraying, American Welding Society (2001), p. 118. ISBN 0-87171-624-0
Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. The center of the process window is defined as zero, and the extreme edges of the process window are ±99%. [6] A PWI greater than or equal to 100% indicates that the profile does not process the product within specification.
Hot-bar reflow is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element (called a thermode) to a temperature sufficient to melt the solder. Pressure is applied through the entire process (usually 15 seconds) to ensure that components stay in place during cooling.
A soldering station has a temperature control and consists of an electrical power supply, control circuitry with provision for user adjustment of temperature and display, and a soldering iron or soldering head with a tip temperature sensor. The station will normally have a stand for the hot iron when not in use, and a wet sponge for cleaning.
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The most common dip soldering operations use zinc-aluminum and tin-lead solders. Solder pot metal: cast iron or steel, electrically heated. Bath temperature: 220 to 260 °C (for binary tin-lead alloys) or 350 to 400 °C (for lead-free alloys) Solder composition: 60% Sn, 40% Pb or eutectic alloy.