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Plastic small-outline package [3] PSON: Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is 0.635 mm. [3] SOIC: Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3 ...
Battery cases; Cases with protection devices; Holsters are commonly used as third-party cases for devices, and/or are made of plastic and without exposed rigid corners. Heavy duty cases are designed to protect from drops and scratches. A standing (or kickstand) case keeps the device standing upright.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product ...
He was the primary designer of the Apple II, introduced in 1977, known as one of the first highly successful mass-produced microcomputers, [6] while Jobs oversaw the development of its foam-molded plastic case and early Apple employee Rod Holt developed its switching power supply. [7]
This is a list of Android distributions, Android-based operating systems (OS) commonly referred to as Custom ROMs or Android ROMs, forked from the Android Open Source Project (AOSP) without Google Play Services included officially in some or all markets, yet maintained independent coverage in notable Android-related sources. The list may ...
Model number Sampling availability Devices APQ8060 [1]: 2011 HP TouchPad • HTC Amaze 4G, Jetstream, Raider 4G, Vivid • Le Pan II • LG Nitro HD • Pantech Element; Samsung Galaxy S II X (SGH-T989D), Galaxy S II LTE, Galaxy S Blaze 4G, Galaxy Tab 7.7 LTE