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Tin-silver-copper. Tin-silver-copper (Sn - Ag - Cu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...
Soldering. Desoldering a contact from a wire. Soldering (US: / ˈsɒdərɪŋ /; UK: / ˈsoʊldərɪŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong ...
Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a eutectic system. Those eutectic metals are alloys that transform directly from solid to liquid state, or vice versa from liquid to solid state, at a specific composition and temperature without ...
The typical current density at which electromigration occurs in Cu or Al interconnects is 10 6 to 10 7 A/cm 2. For solder joints (SnPb or SnAgCu lead-free) used in IC chips, however, electromigration occurs at much lower current densities, e.g. 10 4 A/cm 2. It causes a net atom transport along the direction of electron flow.
The reflow soldering of through-hole components using solder paste in a convection oven process is called intrusive soldering. The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state. At this specific temperature range, the ...