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By modifying the processor behavior and its performance levels, power consumption of a processor can be changed altering its TDP at the same time. That way, a processor can operate at higher or lower performance levels, depending on the available cooling capacities and desired power consumption. [11]: 69–72 [12] [13]
An Intel November 2008 white paper [10] discusses "Turbo Boost" technology as a new feature incorporated into Nehalem-based processors released in the same month. [11]A similar feature called Intel Dynamic Acceleration (IDA) was first available with Core 2 Duo, which was based on the Santa Rosa platform and was released on May 10, 2007.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
The Pentium G3258 CPU is unlocked despite not having the K-suffix. S – performance-optimized lifestyle (low power with 65 W TDP) T – power-optimized lifestyle (ultra low power with 35–45 W TDP) R – BGA packaging / High-performance GPU (Iris Pro 5200 (GT3e)) X – extreme edition (adjustable CPU ratio with no ratio limit)
The Ivy Bridge-EP processor line announced in September 2013 has up to 12 cores and 30 MB third level cache, with rumors of Ivy Bridge-EX up to 15 cores and an increased third level cache of up to 37.5 MB, [45] [46] although an early leaked lineup of Ivy Bridge-E included processors with a maximum of 6 cores.
PS3 NTSC COK-001 motherboard (60 GB version) PS3 PAL COK-002 motherboard. The PS3 received several component revisions which served to reduce power consumption. This in turn resulted in production savings, lower heat production, lower cooling requirements and quieter operation. Since launch, the Cell processor shrank from 90 nm to 45 nm. The ...