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Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]
Slightly cheaper than Sn 63 Pb 37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn 63 Pb 37. [56] Sn 62 Pb 38: 183: Pb: Near "Tinman's solder", used for tinplate fabrication work. [28] Sn 63 Pb 37: 183 [57] Pb: Yes: Sn63, ASTM63A, ASTM63B ...
The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy. This requires peak temperatures in the range of 235–245 °C to achieve wetting and wicking .
In electronics assembly, the eutectic alloy with 63% tin and 37% lead (or 60/40, which is almost identical in melting point) has been the alloy of choice. Other alloys are used for plumbing, mechanical assembly, and other applications.
Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.
the temperature is set slightly above the melting point of the solder used. ... the temperature ranges given for melting solder are: * 63/37: melts between 180-185°C ...
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BAg-37, AG 108 , Braze 255, L ... Good wicking, very low melting point. 19: 17: 56: 5: Ga 3: Ag 63 Cu 24 Zn 13: Ag–Cu–Zn ... Also classified as a solder. Lowest ...