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  2. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 62 Pb 37 Cu 1: 183 [17] Pb: Yes: Similar to Sn 63 Pb 37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. Sn 63 Pb 37 P 0.0015-0.04: 183 ...

  4. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Hot-bar reflow is a selective soldering process where two pre-fluxed, ... Sn Pb 63/37 eutectic solder melts at 183 °C. SAC lead-free solder melts at 217–220 °C ...

  5. Wiped joint - Wikipedia

    en.wikipedia.org/wiki/Wiped_joint

    The solder grade used for leadworking is plumber's solder (80% lead / 20% tin). [i] Although this is thought of as a high melting point solder amongst lead-tin solders, the solidus is relatively constant for all of these solders and it is the liquidus which climbs from the eutectic point at Sn 63% / Pb 37%.

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  7. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]