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The SI unit of absolute thermal resistance is kelvins per watt (K/W) or the equivalent degrees Celsius per watt (°C/W) – the two are the same since the intervals are equal: ΔT = 1 K = 1 °C. The thermal resistance of materials is of great interest to electronic engineers because most electrical components generate heat and need to be cooled.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
Interfacial thermal resistance is a measure of an interface's resistance to thermal flow. This thermal resistance differs from contact resistance, as it exists even at atomically perfect interfaces. Understanding the thermal resistance at the interface between two materials is of primary significance in the study of its thermal properties.
Thermal insulation is the reduction of heat transfer (i.e., the transfer of thermal energy between objects of differing temperature) between objects in thermal contact or in range of radiative influence. Thermal insulation can be achieved with specially engineered methods or processes, as well as with suitable object shapes and materials.
So that practical clothing may be described conveniently by a range of small integers, the unit of thermal resistance, to be called the “tog”, is the resistance that will maintain a temperature difference of 0.1°C. with a flux of 1 watt per square metre, or in more practical terms, 10°C. with a flux of 1 watt per square decimetre.
Simple solutions for transient cooling of an object may be obtained when the internal thermal resistance within the object is small in comparison to the resistance to heat transfer away from the object's surface (by external conduction or convection), which is the condition for which the Biot number is less than about 0.1.
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
For example, a Biot number smaller than about 0.1 implies that heat conduction inside the body offers much lower thermal resistance than the heat convection at the surface, so that temperature gradients are negligible inside of the body (such bodies are sometimes labeled "thermally thin").