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The physical phenomena on which the device relies (such as spinning platters in a hard drive) will also impose limits; for instance, no spinning platter shipping in 2009 saturates SATA revision 2.0 (3 Gbit/s), so moving from this 3 Gbit/s interface to USB 3.0 at 4.8 Gbit/s for one spinning drive will result in no increase in realized transfer rate.
In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providing backward compatibility. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide ...
The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
USB 3.x and USB 1.x Type-A plugs and receptacles are designed to interoperate. To achieve USB 3.0's SuperSpeed (and SuperSpeed+ for USB 3.1 Gen 2), 5 extra pins are added to the unused area of the original 4 pin USB 1.0 design, making USB 3.0 Type-A plugs and receptacles backward compatible to those of USB 1.0.
The USB-IF used WiGig Serial Extension v1.2 specification as its initial foundation for the MA-USB specification and is compliant with SuperSpeed USB (3.0 and 3.1) and Hi-Speed USB (USB 2.0). Devices that use MA-USB will be branded as "Powered by MA-USB", provided the product qualifies its certification program. [106]
Specified USB data rates of 1.5 Mbit/s (Low-speed), 12 Mbit/s (Full-speed), 480 Mbit/s (High-speed) and 5 Gbit/s (SuperSpeed). xHCI 1.0, errata files 1-4: Released on January 17, 2011. Incorporated initial review feedback from larger 1.0 public audience, Save-Restore clarifications, and Hardware LPM support.