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  2. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Tapered body, one larger pad denotes terminal 1 SOT-223 TO-261: 6.5 mm × 3.5 mm × 1.8 mm [57] 4 One terminal is a large heat-transfer pad SOT-323 SC-70: 2 mm × 1.25 mm × 1.1 mm [58] 3 SOT-416 SC-75: 1.6 mm × 0.8 mm × 0.9 mm [59] 3 SOT-663 1.6 mm × 1.2 mm × 0.6 mm [60] 3 SOT-723 1.2 mm × 0.8 mm × 0.55 [61] 3 Has flat leads SOT-883 SC-101

  3. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    [4] These handling difficulties prompted development of alternative SMT packages for common MELF components (like diodes) where the power handling capability needed to be similar to MELF components (superior to low-power 0805/0603, etc. SMT components) but with improved automated pick-and-place handling characteristics. [ 3 ]

  4. List of tablet PC dimensions and case sizes - Wikipedia

    en.wikipedia.org/wiki/List_of_tablet_PC...

    Tablet cases sizes Tablet PC Height Width Depth Screen Case size Acer Iconia Tab A500 [1]: 10.2 in (260 mm) 7 in (180 mm) 0.52 in (13 mm) 10.1 in (260 mm)

  5. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric) ferrite bead. Surface-mount capacitor A MOSFET, placed upon a British postage stamp for size comparison.

  6. Perfboard - Wikipedia

    en.wikipedia.org/wiki/Perfboard

    Top of a copper clad Perfboard with solder pads for each hole. Perfboard is a material for prototyping electronic circuits.It is a thin, rigid sheet with holes pre-drilled at standard intervals across a grid, usually a square grid of 0.1 inches (2.54 mm) spacing.

  7. Small outline integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Small_Outline_Integrated...

    The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP, [citation needed] thereby expanding the margin of operating parameters. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications.

  8. File:SMT sizes, based on original by Zureks.svg - Wikipedia

    en.wikipedia.org/wiki/File:SMT_sizes,_based_on...

    The following other wikis use this file: Usage on de.wikipedia.org Surface-mounted device; Usage on et.wikipedia.org Pinnaühendusega Tehnoloogia

  9. Elastomeric bridge bearing - Wikipedia

    en.wikipedia.org/wiki/Elastomeric_bridge_bearing

    The internal structure of an elastomeric bearing consists of a three layers: a lower "pot" made of steel, which rests on the foundation or footing; a relatively thin elastomeric pad (a rectangle or disk shape) resting on the lower pot; and a steel plate loosely set on top of the elastomeric disk, on top of which the weight of the bridge rests.