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Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...
In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
The basic concept was to use reliable, low-cost, relatively low-technology IC processes and pack a large number of projects per wafer, with several copies of chips from each project remaining preserved. Cooperating fabricators either donated the processed wafers or sold them at cost, as they saw the program as helpful to their own long-term growth.
Roughly saying, digital IC design can be divided into three parts. Electronic system-level design: This step creates the user functional specification. The user may use a variety of languages and tools to create this description. Examples include a C/C++ model, VHDL, SystemC, SystemVerilog Transaction Level Models, Simulink, and MATLAB.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon ) before being diced into die, tested, and packaged.
This is a documentation subpage for Template:Semiconductor manufacturing processes. It may contain usage information, categories and other content that is not part of the original template page. This template is intended primarily for the Semiconductor articles.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.