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  2. DEC J-11 - Wikipedia

    en.wikipedia.org/wiki/DEC_J-11

    It was a high-end chip set designed to integrate the performance and features of the PDP-11/70 onto a handful of chips. It was used in the PDP-11/73 , PDP-11/83 and Professional 380 . It consisted of a data path chip [ 1 ] and a control chip [ 2 ] in ceramic leadless packages mounted on a single ceramic hybrid dual inline package (DIP).

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display (LCD) controller, is mounted directly on glass. Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire.

  4. Dual in-line package - Wikipedia

    en.wikipedia.org/wiki/Dual_in-line_package

    The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices. However, the vast majority of DIPs are manufactured via a thermoset molding process in which an epoxy mold compound is heated and transferred under ...

  5. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the package axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. [5]

  6. Semiconductor package - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_package

    A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits.Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged.

  7. K1810VM86 - Wikipedia

    en.wikipedia.org/wiki/K1810VM86

    For brevity, the table above lists only the chip variants in a plastic DIP (prefix КР). Not listed separately are variants in a ceramic DIP (prefix КМ for commercial version and prefix М for the military version). Additionally, many devices in the K580 series could be used for the K1810 series as well.

  8. The 7 Ceramic Cookware Sets That Are Worth Your Money - AOL

    www.aol.com/9-best-ceramic-cookware-sets...

    SearSmart Ceramic Nonstick 10-Piece Cookware Set. Some ceramic cookware can’t take the heat, but that definitely isn’t the case for the GreenPan SearSmart 10-Piece Set, which includes a ...

  9. Chip carrier - Wikipedia

    en.wikipedia.org/wiki/Chip_carrier

    A leadless chip carrier (LCC) has no "leads", but instead has rounded pins through the edges of the ceramic or molded plastic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and commercial markets are typically packaged in plastic.