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An active laptop cooler. A laptop/notebook cooler, cooling pad, cooler pad or chill mat is an accessory for laptop computers intended to reduce their operating temperature when the laptop is unable to sufficiently cool itself. Laptop coolers are intended to protect both the laptop from overheating and the user from suffering heat related ...
The colder the cooling medium (the air), the more effective the cooling. Cooling air temperature can be improved with these guidelines: Supply cool air to the hot components as directly as possible. Examples are air snorkels and tunnels that feed outside air directly and exclusively to the CPU or GPU cooler.
The first of the cooling load factors used in this method is the CLTD, or the Cooling Load Temperature Difference. This factor is used to represent the temperature difference between indoor and outdoor air with the inclusion of the heating effects of solar radiation. [1] [5] The second factor is the CLF, or the cooling load factor.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
The coefficient of performance or COP (sometimes CP or CoP) of a heat pump, refrigerator or air conditioning system is a ratio of useful heating or cooling provided to work (energy) required. [1] [2] Higher COPs equate to higher efficiency, lower energy (power) consumption and thus lower operating costs. The COP is used in thermodynamics.
Power usage effectiveness (PUE) or power unit efficiency is a ratio that describes how efficiently a computer data center uses energy; specifically, how much energy is used by the computing equipment (in contrast to cooling and other overhead that supports the equipment).
For example, a laptop's CPU cooling system may be designed for a 20 W TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the laptop's CPU. A cooling system can do this using an active cooling method (e.g. conduction coupled with forced convection) such as a heat sink with a fan ...
Space cooling on one hand, and equipment cooling on the other, cannot be viewed as two isolated parts of the overall thermal challenge. The main purpose of an equipment facility's air-distribution system is to distribute conditioned air in such a way that the electronic equipment is cooled effectively.