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DigiKey is the fourth largest electronic component distributor in North America and the fifth largest electronic component distributor overall. [3] Stordahl privately owns the company. [4] The name "Digi-Key" is a reference to the "Digi-Keyer Kit," a digital electronic keyer kit that Stordahl developed and marketed to amateur radio enthusiasts.
DataSheets.com is a searchable database of electronic component data sheets and purchasing information. [1] The website is intended for Design engineers and Electronics purchasing agents. [ 2 ] DataSheets.com was developed by UBM in conjunction with SiliconExpert Technologies .
In cryptography, the EFF DES cracker (nicknamed "Deep Crack") is a machine built by the Electronic Frontier Foundation (EFF) in 1998, to perform a brute force search of the Data Encryption Standard (DES) cipher's key space – that is, to decrypt an encrypted message by trying every possible key.
LTspice is a SPICE-based analog electronic circuit simulator computer software, produced by semiconductor manufacturer Analog Devices (originally by Linear Technology). [2] It is the most widely distributed and used SPICE software in the industry. [6]
It can, for example, potentially locate deleted emails [2] and scan a disk for text strings to use them as a password dictionary to crack encryption. [3] FTK is also associated with a standalone disk imaging program called FTK Imager. This tool saves an image of a hard disk in one file or in segments that may be later on reconstructed.
A typical top-down documentation tree is: manufacturer website, manufacturer marketing slides, manufacturer datasheet for the exact physical chip, manufacturer detailed reference manual that describes common peripherals and aspects of a physical chip family, ARM core generic user guide, ARM core technical reference manual, ARM architecture ...
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
Today, surface-mounted CMOS versions of the 7400 series are used in various applications in electronics and for glue logic in computers and industrial electronics. The original through-hole devices in dual in-line packages (DIP/DIL) were the mainstay of the industry for many decades.