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  2. Euler–Bernoulli beam theory - Wikipedia

    en.wikipedia.org/wiki/Euler–Bernoulli_beam_theory

    Euler–Bernoulli beam theory (also known as engineer's beam theory or classical beam theory) [1] is a simplification of the linear theory of elasticity which provides a means of calculating the load-carrying and deflection characteristics of beams.

  3. Bending stiffness - Wikipedia

    en.wikipedia.org/wiki/Bending_stiffness

    The bending stiffness is the resistance of a member against bending deflection/deformation.It is a function of the Young's modulus, the second moment of area of the beam cross-section about the axis of interest, length of the beam and beam boundary condition.

  4. Cantilever method - Wikipedia

    en.wikipedia.org/wiki/Cantilever_method

    The cantilever method is an approximate method for calculating shear forces and moments developed in beams and columns of a frame or structure due to lateral loads. The applied lateral loads typically include wind loads and earthquake loads, which must be taken into consideration while designing buildings.

  5. Flexural modulus - Wikipedia

    en.wikipedia.org/wiki/Flexural_modulus

    For a 3-point test of a rectangular beam behaving as an isotropic linear material, where w and h are the width and height of the beam, I is the second moment of area of the beam's cross-section, L is the distance between the two outer supports, and d is the deflection due to the load F applied at the middle of the beam, the flexural modulus: [1]

  6. Shear modulus - Wikipedia

    en.wikipedia.org/wiki/Shear_modulus

    The shear modulus is one of several quantities for measuring the stiffness of materials. All of them arise in the generalized Hooke's law: . Young's modulus E describes the material's strain response to uniaxial stress in the direction of this stress (like pulling on the ends of a wire or putting a weight on top of a column, with the wire getting longer and the column losing height),

  7. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    The reflected sound signal is used for the image creation. The lateral resolutions depends on the ultrasonic frequency, the acoustic beam diameter and the signal-to-noise ratio (contrast). Unbonded areas, i.e. impurities or voids, do not reflect the ultrasonic beam like bonded areas, therefore a quality assessment of the bond is possible. [3]

  8. Specific modulus - Wikipedia

    en.wikipedia.org/wiki/Specific_modulus

    By examining the formulas for area moment of inertia, we can see that the stiffness of this beam will vary approximately as the third power of the radius or height. Thus the second moment of area will vary approximately as the inverse of the cube of the density, and performance of the beam will depend on Young's modulus divided by density cubed .

  9. Stiffness - Wikipedia

    en.wikipedia.org/wiki/Stiffness

    The stiffness, , of a body is a measure of the resistance offered by an elastic body to deformation. For an elastic body with a single degree of freedom (DOF) (for example, stretching or compression of a rod), the stiffness is defined as k = F δ {\displaystyle k={\frac {F}{\delta }}} where,