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The heat generated dissipates into the sample on both sides of the sensor, at a rate depending on the thermal transport properties of the material. By recording temperature vs. time response in the sensor, the thermal conductivity, thermal diffusivity and specific heat capacity of the material can be calculated.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance .
The thermal conductivity is a characteristic of the particular material. Values of thermal conductivities for various materials are listed in the list of thermal conductivities . As mentioned earlier in the article the convection heat transfer coefficient for each stream depends on the type of fluid, flow properties and temperature properties.
Time-domain thermoreflectance (TDTR) is a method by which the thermal properties of a material can be measured, most importantly thermal conductivity.This method can be applied most notably to thin film materials (up to hundreds of nanometers thick), which have properties that vary greatly when compared to the same materials in bulk.
Searle's bar method (named after George Frederick Charles Searle) is an experimental procedure to measure thermal conductivity of material. A bar of material is being heated by steam on one side and the other side cooled down by water while the length of the bar is thermally insulated.
Very high thermal conductivity measurements up to 22,600 w m −1 K −1 were reported by Fenton, E.W., Rogers, J.S. and Woods, S.D. in reference 570 on page 1458, 41, 2026–33, 1963. The data is listed on pages 6 through 8 and graphed on page 1 where Fenton and company are on curves 63 and 64.
A 2008 review paper written by Philips researcher Clemens J. M. Lasance notes that: "Although there is an analogy between heat flow by conduction (Fourier's law) and the flow of an electric current (Ohm’s law), the corresponding physical properties of thermal conductivity and electrical conductivity conspire to make the behavior of heat flow ...