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The device being tested is electrically stimulated and the device output is monitored. This technique is applied to the back side of the semiconductor device, thereby allowing direct access of the laser to the device active diffusion regions. The effect of the laser on the active transistor region is to generate a localized photocurrent. This ...
As the laser locally heats a defective area on a metal line which is carrying a current, the resulting resistance changes can be detected by monitoring the input current to the device. OBIRCH is useful for detecting electromigration effects resulting in open metal lines. A constant voltage is applied to the device-under-test (DUT). An area of ...
In semiconductor laser theory, the optical gain is produced in a semiconductor material. The choice of material depends on the desired wavelength and properties such as modulation speed. It may be a bulk semiconductor, but more often a quantum heterostructure. Pumping may be electrically or optically . All these structures can be described in a ...
The instrument obtains voltage waveform and timing information by monitoring the interaction of laser light with the changes in the electric field across a p-n junction. As the laser reaches the silicon surface, a certain amount of that light is reflected back. The amount of reflected laser light from the junction is sampled at various points ...
Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.
Nanowire lasers can be grown site-selectively on Si/SOI wafers with conventional MBE techniques, allowing for pristine structural quality without defects. Nanowire lasers using the group-III nitride and ZnO materials systems have been demonstrated to emit in the visible and ultraviolet, however infrared at the 1.3–1.55 μm is important for telecommunication bands. [3]
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The damage caused can be repaired by subjecting the crystal to high temperature. This process is called annealing. Furnace anneals may be integrated into other furnace processing steps, such as oxidations, or may be processed on their own. Furnace anneals are performed by equipment especially built to heat semiconductor wafers. Furnaces are ...