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Nanomanufacturing differs from molecular manufacturing, which is the manufacture of complex, nanoscale structures by means of nonbiological mechanosynthesis (and subsequent assembly). [1] The term "nanomanufacturing" is widely used, e.g. by the European Technology Platform MINAM [2] and the U.S. National Nanotechnology Initiative (NNI). [3]
Manufacturing in the context of productive nanosystems is not related to conventional technologies used to manufacture nanomaterials such as carbon nanotubes and nanoparticles. When Drexler independently coined and popularized the term "nanotechnology", he envisioned manufacturing technology based on molecular machine systems.
Advancements in this technology through the use of nanoparticles would lead to increased safety, less need for regular inspection, and more efficient materials free from fatigue issues for construction. [22] Steel cables can be strengthened using carbon nanotubes.
Molecular nanotechnology (MNT) is a technology based on the ability to build structures to complex, atomic specifications by means of mechanosynthesis. [1] This is distinct from nanoscale materials.
The 90 nm process refers to the technology used in semiconductor manufacturing to create integrated circuits with a minimum feature size of 90 nanometers. It was an advancement over the previous 130 nm process.
Nanoelectronics refers to the use of nanotechnology in electronic components. The term covers a diverse set of devices and materials, with the common characteristic that they are so small that inter-atomic interactions and quantum mechanical properties need to be studied extensively.
The IEEE traces its founding to 1884 and the American Institute of Electrical Engineers.In 1912, the rival Institute of Radio Engineers was formed. [6] Although the AIEE was initially larger, the IRE attracted more students and was larger by the mid-1950s.
Gate array design is a manufacturing method in which diffused layers, each consisting of transistors and other active devices, are predefined and electronics wafers containing such devices are "held in stock" or unconnected prior to the metallization stage of the fabrication process.