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Penetrating sealers often require the use of special cleaners which both clean and top up the repellent ingredient left on the stone surface. These sealers are often breathable to a certain degree, but do not penetrate deeply enough (generally less than 1mm) to be effective against salt attack, such as efflorescence and spalling.
Buffered oxide etch is commonly used for more controllable etching. [1] Buffering HF with NH 4 F results in a solution with a more stable pH; thus, more stable concentrations of HF and HF − 2, and a more stable etch rate. [2] Some oxides produce insoluble products in HF solutions.
All-in-one self-etch adhesive and a single component universal adhesive, used in the adhesion of direct and indirect dental restorations. Also known as a "bonderizer" bonding agents (spelled dentin bonding agents in American English) are resin materials used to make a dental composite filling material adhere to both dentin and enamel.
Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
Resin sealants require a phosphoric acid solution ("etch") to create microscopic porosity into which the sealant material can flow thereby increasing retention, increasing surface area and improving the strength of the bond between the sealant and the tooth surface. [28] Etching time varies from 15 to 60 seconds, depending on the product.
ferric chloride may be used for etching copper or zinc plates, whereas nitric acid may be used for etching zinc or steel plates. Typical solutions are 1 part FeCl 3 to 1 part water and 1 part nitric to 3 parts water. The strength of the acid determines the speed of the etching process. The etching process is known as biting (see also spit ...