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Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics. [55] [56] [13] Not recommended for gold. [12] General-purpose. Sn 61 Pb 36 Ag 3: 205 [62] Pb
BAg-7, AG 102, L-Ag55Sn, Ag 1, AMS 4763, Braze 560, Silvaloy A56T, Matti-sil 56Sn, BrazeTec 5600, Silver Braze 56. Low-melting. Excellent for general purpose brazing of close-tolerance joints. Lowest melting point cadmium-free silver alloy. Low zinc content minimizes issues with prolonged or repeated heating. Slight tendency to liquate.
Pin brazing is a metallurgically safe [citation needed] method of making electrical connections [1] to steel and ductile iron pipelines [citation needed] as well as other metallic structures, [2] which are to be cathodically protected or electrically earthed.
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
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