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  2. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

  3. Carlisle Companies - Wikipedia

    en.wikipedia.org/wiki/Carlisle_Companies

    Carlisle Companies Incorporated is a supplier of construction products that make buildings more energy efficient and resilient. The company manufactures and sells single-ply roofing products as well as warranted systems and accessories for the commercial building industry.

  4. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  5. Pressure-sensitive adhesive - Wikipedia

    en.wikipedia.org/wiki/Pressure-sensitive_adhesive

    Adhesives may be broadly divided in two classes: structural and pressure-sensitive. To form a permanent bond, structural adhesives harden via processes such as evaporation of solvent (for example, white glue), reaction with UV radiation (as in dental adhesives), chemical reaction (such as two part epoxy), or cooling (as in hot melt).

  6. Chemistry of pressure-sensitive adhesives - Wikipedia

    en.wikipedia.org/wiki/Chemistry_of_pressure...

    The wear of an adhesive tape as it slides across a substrate can be estimated using Archard's Law of Adhesive Wear, where and are the hardness and wear coefficients of the adhesive tape, is the distance the adhesive is dragged across the substrate surface, is the total normal load acting on the adhesive tape, and is the volume of the adhesive ...

  7. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...