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Download as PDF; Printable version; ... ASUS Eee Pad Transformer [6] 10.7 in (270 mm) 6.9 in (180 mm) ... List of tablet PC dimensions and case sizes.
Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity. [4] By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.
Today, the most widely recognized standards for this mechanical structure are IEEE 1101.1, IEEE 1101.10 (also known commonly as "dot ten") and IEEE 1101.11. IEEE 1101.10 covers the additional mechanical and electromagnetic interference features required for VITA 1.1-1997(R2002), which is the VME64 Extensions standard, as well as PICMG 2.0 (R3.0 ...
The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
Download QR code; Print/export Download as PDF; Printable version; In other projects Wikimedia Commons; ... is a variant of TSOP with an exposed pad on the bottom side.
Digital's RK05 and RL01 were early examples using single 14-inch platters in removable packs, the entire drive fitting in a 10.5-inch-high rack space (six rack units). In the mid-to-late 1980s the similarly sized Fujitsu Eagle, which used (coincidentally) 10.5-inch platters, was a popular product.
The exposed pad (EP) variant of small outline packages can increase heat dissipation by as much as 1.5 times over a standard TSSOP, [citation needed] thereby expanding the margin of operating parameters. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications.