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Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...
Wet etching was widely used in the 1960s and 1970s, [144] [145] but it was replaced by dry etching/plasma etching starting at the 10 micron to 3 micron nodes. [146] [147] This is because wet etching makes undercuts (etching under mask layers or resist layers with patterns). [148] [149] [150] Dry etching has become the dominant etching technique ...
In etching, a liquid ("wet") or plasma ("dry") chemical agent removes the uppermost layer of the substrate in the areas that are not protected by photoresist. In semiconductor fabrication, dry etching techniques are generally used, as they can be made anisotropic, in order to avoid significant undercutting of the photoresist pattern. This is ...
The etching solution usually has no preferred direction of attacking the substrate, therefore isotropic etching takes place. In semiconductor engineering, however it is often required that the sidewalls of the etched trenches are steep. This is usually realized with methods that operate in the gas-phase such as reactive ion etching. These ...
In semiconductor manufacturing, isotropic etching is a method commonly used to remove material from a substrate via a chemical process using an etchant substance. The etchant may be in liquid-, gas- or plasma-phase, [1] although liquid etchants such as buffered hydrofluoric acid (BHF) for silicon dioxide etching are more often used.
Like surface micromachining, bulk micromachining can be performed with wet or dry etches, although the most common etch in silicon is the anisotropic wet etch. This etch takes advantage of the fact that silicon has a crystal structure, which means its atoms are all arranged periodically in lines and planes. Certain planes have weaker bonds and ...