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In all cases, electromigration can cause changes in dimensions and parameters of the transistor gates and semiconductor junctions. Mechanical stresses, high currents, and corrosive environments forming of whiskers and short circuits. These effects can occur both within packaging and on circuit boards. Formation of silicon nodules.
Electrical breakdown in an electric discharge showing the ribbon-like plasma filaments from a Tesla coil.. In electronics, electrical breakdown or dielectric breakdown is a process that occurs when an electrically insulating material (a dielectric), subjected to a high enough voltage, suddenly becomes a conductor and current flows through it.
Diagram of a simple circuit with an inductance L and a flyback diode D.The resistor R represents the resistance of the inductor's windings. A flyback diode is any diode connected across an inductor used to eliminate flyback, which is the sudden voltage spike seen across an inductive load when its supply current is suddenly reduced or interrupted.
Break in the shield Create a break in the signal cable shield conductor. [5] The break should be at the load end. This is often called ground lifting. It is the simplest solution; it leaves the ground currents to flow through the other arm of the loop. Some sound system components have ground lifting switches at inputs, which disconnect the ground.
Induction causes a separation of the charges inside the electroscope's metal rod, so that the top terminal gains a net charge of opposite polarity to that of the object, while the gold leaves gain a charge of the same polarity. Since both leaves have the same charge, they repel each other and spread apart.
CAF commonly occurs between adjacent vias (i.e. plated through holes) inside a PCB, as the copper migrates along the glass/resin interface from anode to cathode.CAF failures can manifest as current leakage, intermittent electrical shorts, and even dielectric breakdown between conductors in printed circuit boards. [3]
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP), also called ball-and-socket, [1] is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may ...
Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface.