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  2. Thermoelectric cooling - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_cooling

    Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.

  3. Thermoelectric temperature control - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_temperature...

    The efficiency can be determined by the following relation: = where is the temperature of the cooling surface and is the temperature of the heating surface.. The key energy phenomena and the reason of defining a specific use of thermoelectric elements (Figure 1) as heat pump resides in the energy fluxes that those elements allow realizing: [8] [9]

  4. Thermoelectric effect - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_effect

    Seebeck effect in a thermopile made from iron and copper wires A thermoelectric circuit composed of materials of different Seebeck coefficients (p-doped and n-doped semiconductors), configured as a thermoelectric generator. If the load resistor at the bottom is replaced with a voltmeter, the circuit then functions as a temperature-sensing ...

  5. Thermoelectric generator - Wikipedia

    en.wikipedia.org/wiki/Thermoelectric_generator

    Harvesting that heat energy using a thermoelectric generator can increase the fuel efficiency of the car. Thermoelectric generators have been investigated to replace the alternators in cars demonstrating a 3.45% reduction in fuel consumption. [33] Projections for future improvements are up to a 10% increase in mileage for hybrid vehicles. [34]

  6. Thermal copper pillar bump - Wikipedia

    en.wikipedia.org/wiki/Thermal_copper_pillar_bump

    A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).

  7. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Peltier cooling plates / ˈ p ɛ l t i. eɪ / take advantage of the Peltier effect to create a heat flux between the junction of two different conductors of electricity by applying an electric current. [9] This effect is commonly used for cooling electronic components and small instruments.

  8. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    To the right is a smaller heat sink cooling another integrated circuit of the motherboard. Typical heatsink-fan combination found on a consumer laptop. The heatpipes which contain a working fluid make direct contact with the CPU and GPU, conducting heat away from the component and transferring it to the fin-stack mounted on the exhaust port of ...

  9. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Thermoelectric materials are sandwiched between two substrates made by high thermal conductivity materials. [12] N-type and p-type thermoelectric units are connected sequentially in series as the middle layer. When a high power LED generates heat, the heat will first transfer through the top substrate to the thermoelectric units.