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  2. Ostomy system - Wikipedia

    en.wikipedia.org/wiki/Ostomy_system

    The internal opening must be the correct size to accommodate the individual's stoma while protecting the skin from contact with waste. The methods for sizing this opening vary depending on the type of wafer/baseplate; some pre-cut sizes are available, some users customize the opening using scissors.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).

  4. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    The size of wafers for photovoltaics is 100–200 mm square and the thickness is 100–500 μm. [10] Electronics use wafer sizes from 100 to 450 mm diameter. The largest wafers made have a diameter of 450 mm, [11] but are not yet in general use.

  5. List of semiconductor fabrication plants - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    Wafer size – largest wafer diameter that a facility is capable of processing. (Semiconductor wafers are circular.) Process technology node – size of the smallest features that the facility is capable of etching onto the wafers. Production capacity – a manufacturing facility's nameplate capacity. Generally max wafers produced per month.

  6. Urostomy - Wikipedia

    en.wikipedia.org/wiki/Urostomy

    The urine is collected through a bag that attaches on the outside of the body over the stoma. Indiana pouch; A "continent urostomy" is an artificial bladder formed out of a segment of small bowel. This is fashioned into a pouch, which can be emptied intermittently with a catheter. It avoids the need for a stoma bag on the urostomy.

  7. Bow and warp of semiconductor wafers and substrates

    en.wikipedia.org/wiki/Bow_and_warp_of...

    Warp is the difference between the maximum and the minimum distances of the median surface of a free, un-clamped wafer from the reference plane defined above. This definition follows ASTM F657, [ 2 ] and ASTM F1390.