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A cold soldering iron requires time to reach working temperature and must be kept hot between solder joints. Thermal transfer may be inhibited if the tip is not kept properly wetted during use. With resistance soldering an intense heat can be rapidly developed directly within the joint area and in a tightly controlled manner.
Solder can then melt onto the hot leadout but it is then forced to flow onto the other component (the PCB copper pad) which is completely cold. Inadequate through-heating of components is the main cause of dry (gray) solder joints. What little heat there is, sinks away through the workpiece and the solder never flows properly.
The reflow soldering of through-hole components using solder paste in a convection oven process is called intrusive soldering. The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state. At this specific temperature range, the ...
Cold welding. Cold welding or contact welding is a solid -state welding process in which joining takes place without fusion or heating at the interface of the two parts to be welded. Unlike in fusion welding, no liquid or molten phase is present in the joint. Cold welding was first recognized as a general materials phenomenon in the 1940s.
Crimp (joining) Crimp tool for 0.14 mm 2 to 10 mm 2 (26–8 AWG) insulated and non-insulated ferrules. Crimping is a method of joining two or more pieces of metal or other ductile material by deforming one or both of them to hold the other. The bend or deformity is called the crimp. [1][2] Crimping tools are used to create crimps.
X-ray picture of inadequate solder joints. Rework is practiced in many kinds of manufacturing when defective products are found. [2] For electronics, defects may include: Poor solder joints because of faulty assembly or thermal cycling. Solder bridges—unwanted drops of solder that connect points that should be isolated from each other.