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Left side: solar cells made of polycrystalline silicon Right side: polysilicon rod (top) and chunks (bottom). Polycrystalline silicon, or multicrystalline silicon, also called polysilicon, poly-Si, or mc-Si, is a high purity, polycrystalline form of silicon, used as a raw material by the solar photovoltaic and electronics industry.
A semiconductor crystal boule is normally cut into circular wafers using an inside hole diamond saw or diamond wire saw, and each wafer is lapped and polished to provide substrates suitable for the fabrication of semiconductor devices on its surface.
Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
Silicon wafers are generally not 100% pure silicon, but are instead formed with an initial impurity doping concentration between 10 13 and 10 16 atoms per cm 3 of boron, phosphorus, arsenic, or antimony which is added to the melt and defines the wafer as either bulk n-type or p-type. [27]
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still ...
Wafer carriers or cassettes, which can hold several wafers at once, were developed to carry several wafers between process steps, but wafers had to be individually removed from the carrier, processed and returned to the carrier, so acid-resistant carriers were developed to eliminate this time consuming process, so the entire cassette with ...
Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board , via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical ...
A typical wafer is composed of a silicon wafer with oxide, 30 - 200 nm Ti or Cr layer and Au layer of > 500 nm thickness. [citation needed] In the wafer fabrication a nickel (Ni) or a platinum (Pt) layer is added between the gold and the substrate wafer as diffusion barrier. [10]