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  2. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon

  3. SMIF (interface) - Wikipedia

    en.wikipedia.org/wiki/SMIF_(interface)

    Both wafers and reticles can be handled by SMIF pods in a semiconductor fabrication environment. Used in lithographic tools, reticles or photomasks contain the image that is exposed on a coated wafer in one processing step of a complete integrated semiconductor manufacturing cycle. Because reticles are linked so directly with wafer processing ...

  4. wafer-to-wafer (also wafer-on-wafer) stacking – bonding and integrating whole processed wafers atop one another before dicing the stack into dies wire bonding – using tiny wires to interconnect an IC or other semiconductor device with its package (see also thermocompression bonding, flip chip, hybrid bonding, etc.)

  5. Die (integrated circuit) - Wikipedia

    en.wikipedia.org/wiki/Die_(integrated_circuit)

    Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.

  6. Semiconductor device - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device

    Outlines of some packaged semiconductor devices. A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators.

  7. Overlay control - Wikipedia

    en.wikipedia.org/wiki/Overlay_Control

    In silicon wafer manufacturing overlay control is the control of pattern-to-pattern alignment necessary in the manufacture of silicon wafers. Silicon wafers are currently manufactured in a sequence of steps, each stage placing a pattern of material on the wafer; in this way transistors, contacts, etc., all made of different materials, are laid ...

  8. Planar process - Wikipedia

    en.wikipedia.org/wiki/Planar_process

    The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together. It is the primary process by which silicon integrated circuit chips are built, and it is the most commonly used method of producing junctions during the manufacture of ...

  9. List of semiconductor materials - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).