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Typical LED package including thermal management design Thermal animation of a high powered A19 sized LED light bulb, created using high resolution computational fluid dynamics (CFD) analysis software, showing temperature contoured LED heat sink and flow trajectories Thermal animation of a high power density industrial PAR 64 LED downlight heat sink design, created using high resolution CFD ...
Thermal stress: Sudden failures are most often caused by thermal stresses. When the epoxy resin package reaches its glass transition temperature, it starts rapidly expanding, causing mechanical stresses on the semiconductor and the bonded contact, weakening it or even tearing it off. Conversely, very low temperatures can cause cracking of the ...
Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
Cree's XLamp XM-L LEDs, commercially available in 2011, produce 100 lm/W at their full power of 10 W, and up to 160 lm/W at around 2 W input power. In 2012, Cree announced a white LED giving 254 lm/W, [10] and 303 lm/W in March 2014. [11] Practical general lighting needs high-power LEDs, of one watt or more.
High-power LEDs (HP-LEDs) or high-output LEDs (HO-LEDs) can be driven at currents from hundreds of mA to more than an ampere, compared with the tens of mA for other LEDs. Some can emit over a thousand lumens. [50] [51] LED power densities up to 300 W/cm 2 have been achieved. Since overheating is destructive, the HP-LEDs must be mounted on a ...
A 230-volt LED filament lamp, with an E27 base. The filaments are visible as the eight yellow vertical lines. An assortment of LED lamps commercially available in 2010: floodlight fixtures (left), reading light (center), household lamps (center right and bottom), and low-power accent light (right) applications An 80W Chips on board (COB) LED module from an industrial light luminaire, thermally ...
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
LED filament bulbs have many smaller, lower-power LED chips than other types, avoiding the need for a heatsink, but they must still pay attention to thermal management; multiple heat-dissipation paths are needed for reliable operation. The lamp may contain a high-thermal-conductivity gas blend to better conduct heat from the LED filament to the ...