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  2. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  3. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    This is generally known as Thermal Throttling in the case of reduction of clock speeds, or Thermal Shutdown in the case of a complete shutdown of the device or system. Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling).

  4. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  5. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The idea of thermal resistance of a semiconductor heat sink is an approximation. It does not take into account non-uniform distribution of heat over a device or heat sink. It only models a system in thermal equilibrium and does not take into account the change in temperatures with time.

  6. Thermally conductive pad - Wikipedia

    en.wikipedia.org/wiki/Thermally_conductive_pad

    In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).

  7. Dynamic frequency scaling - Wikipedia

    en.wikipedia.org/wiki/Dynamic_frequency_scaling

    The dynamic power (switching power) dissipated by a chip is C·V 2 ·A·f, where C is the capacitance being switched per clock cycle, V is voltage, A is the activity factor [1] indicating the average number of switching events per clock cycle by the transistors in the chip (as a unitless quantity) and f is the clock frequency.

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  9. Time clock - Wikipedia

    en.wikipedia.org/wiki/Time_clock

    Electronic time clock. A time clock, sometimes known as a clock card machine, punch clock, or time recorder, is a device that records start and end times for hourly employees (or those on flexi-time) at a place of business. In mechanical time clocks, this was accomplished by inserting a heavy paper card, called a time card