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This is generally known as Thermal Throttling in the case of reduction of clock speeds, or Thermal Shutdown in the case of a complete shutdown of the device or system. Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling).
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
The idea of thermal resistance of a semiconductor heat sink is an approximation. It does not take into account non-uniform distribution of heat over a device or heat sink. It only models a system in thermal equilibrium and does not take into account the change in temperatures with time.
The P series offers independent software vendor (ISV) certifications from software vendors such as Adobe and Autodesk for various computer-aided design (CAD) software. [ 3 ] All 16" models have a standard 6-row ThinkPad Precision Keyboard (with Numeric Keypad and optional backlight), TrackPoint and touchpad, and optional fingerprint reader.
A heatsink's thermal mass can be considered as a capacitor (storing heat instead of charge) and the thermal resistance as an electrical resistance (giving a measure of how fast stored heat can be dissipated). Together, these two components form a thermal RC circuit with an associated time constant given by the product of R and C. This quantity ...
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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).