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The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.
The solder paste composition, eg. flux with higher activation temperature, together with the wetting characteristics of the solder ball, are the most significant mitigation factors. [1] Since the warping of the circuit board or integrated circuit may disappear when the board cools, an intermittent fault may be created.
Lead-free reflow soldering temperatures are higher, which results in more graping. Graping is also caused by increased surface oxidation. The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area to flux ratio of the solder particle, resulting in flux exhaustion.
Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...
Ideally, a solder paste should have, at minimum, a 4-hour stencil life. The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process.
Another plus is you can easily make your own date paste at home in a blender. To do so, mix 3/4 cup of water, 1/2 teaspoon of vanilla extract, and about 1 cup of warm, pitted dates.