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  2. Digital pattern generator - Wikipedia

    en.wikipedia.org/wiki/Digital_pattern_generator

    A digital pattern generator is a piece of electronic test equipment or software used to generate digital electronic stimuli. Digital electronics stimuli are a specific kind of electrical waveform varying between two conventional voltages that correspond to two logic states ("low state" and "high state", "0" and "1").

  3. Radioisotope thermoelectric generator - Wikipedia

    en.wikipedia.org/wiki/Radioisotope...

    Diagram of an RTG used on the Cassini probe. A radioisotope thermoelectric generator (RTG, RITEG), sometimes referred to as a radioisotope power system (RPS), is a type of nuclear battery that uses an array of thermocouples to convert the heat released by the decay of a suitable radioactive material into electricity by the Seebeck effect.

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.

  5. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are ...

  6. Chip-scale package - Wikipedia

    en.wikipedia.org/wiki/Chip-scale_package

    [2] The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer , resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip ...

  7. Quad flat package - Wikipedia

    en.wikipedia.org/wiki/Quad_Flat_Package

    A thin quad flat pack (TQFP) provides the same benefits as the metric QFP, but is thinner. Regular QFP are 2.0 to 3.8 mm thick depending on size. TQFP packages range from 32 pins with a 0.8 mm lead pitch, in a package 5 mm by 5 mm by 1 mm thick, to 256 pins, 28 mm square, 1.4 mm thick and a lead pitch of 0.4 mm. [2]

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