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Sheet resistance is a special case of resistivity for a uniform sheet thickness. Commonly, resistivity (also known as bulk resistivity, specific electrical resistivity, or volume resistivity) is in units of Ω·m, which is more completely stated in units of Ω·m 2 /m (Ω·area/length).
Thin-film thickness monitors, deposition rate controllers, and so on, are a family of instruments used in high and ultra-high vacuum systems. They can measure the thickness of a thin film, not only after it has been made, but while it is still being deposited, and some can control either the final thickness of the film, the rate at which it is deposited, or both.
The basic form of a 2-dimensional thin film equation is [3] [4] [5] = where the fluid flux is = [(+ ^) + ^] +, and μ is the viscosity (or dynamic viscosity) of the liquid, h(x,y,t) is film thickness, γ is the interfacial tension between the liquid and the gas phase above it, is the liquid density and the surface shear.
One advantage to spin coating thin films is the uniformity of the film thickness. Owing to self-leveling, thicknesses do not vary more than 1%. The thickness of films produced in this manner may also affect the optical properties of such materials.
Compared to traditional porosimeters, Ellipsometer porosimeters are well suited to very thin film pore size and pore size distribution measurement. Film porosity is a key factor in silicon based technology using low-κ materials, organic industry (encapsulated organic light-emitting diodes) as well as in the coating industry using sol gel ...
For thin films in liquids, there is an approximate analytical result, relating the elastic compliance of the film, J F ’ to the ratio of Δ(w/2); and Δf. The shear compliance is the inverse of the shear modulus, G. In the thin-film limit, the ratio of Δ(w/2) and –Δf is independent of film thickness. It is an intrinsic property of the film.
The challenge of characterizing thin films involves extracting t, n(λ) and k(λ) of the film from the measurement of R(λ) and/or T(λ). This can be achieved by combining the Forouhi–Bloomer dispersion equations for n ( λ ) and k ( λ ) with the Fresnel equations for the reflection and transmission of light at an interface [ 21 ] to obtain ...
Evaporation is a common method of thin-film deposition. The source material is evaporated in a vacuum. The vacuum allows vapor particles to travel directly to the target object (substrate), where they condense back to a solid state. Evaporation is used in microfabrication, and to make macro-scale products such as metallized plastic film.