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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. TO-3: Panel-mount with leads; TO-5: Metal can package with radial leads; TO-18: Metal can package with radial leads; TO-39; TO-46; TO-66: Similar shape to the TO-3 but smaller
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [ 1 ] SOT23-5 differs from SOT23 in a wider body of 1.6 mm (0.063 in) instead of 1.3 mm (0.051 in).
NPN silicon transistors with similar properties are also made in a variety of small through-hole and surface mount packages including TO-92, SOT-23, and SOT-223. Replacements for the 2N2222 are commonly available in the cheaper TO-92 packaging, where it is known as the PN2222 or P2N2222, which has similar specifications except for the lower ...
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. Application
Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.
The Double Decawatt Package, [1] [2] D2PAK, SOT404 or DDPAK, standardized as TO-263, [3] is a semiconductor package type intended for surface mounting on circuit boards.The TO-263 is designed by Motorola.
Flatpack is a US military standardized printed-circuit-board surface-mount-component package. The military standard MIL-STD-1835C defines: Flat package (FP). A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery.