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A denshi block (or electronic block; the name "denshi" 電子 is Japanese word for "electronics") is a small plastic box containing an electronic component. The blocks are used in some educational electronics kits, such as the Gakken EX-150, to allow experiments to be performed easily and safely.
Thermally-enhanced thin shrink small-outline package [15] mini-SOIC: Mini small-outline integrated circuit MSOP: Mini small-outline package: Maxim uses the trademarked name μMAX for MSOP packages PSOP: Plastic small-outline package [3] PSON: Plastic small-outline no-lead package: QSOP: Quarter-size small-outline package: The terminal pitch is ...
A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Small outline actually refers to IC packaging standards from at least two different organizations: JEDEC: MS-012 PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. MS-013 VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. JEITA (previously EIAJ, which term some vendors still use):
The SOIC (Small Outline IC), a surface-mount package which is currently [when?] very popular, particularly in consumer electronics and personal computers, is essentially a shrunk version of the standard IC PDIP, the fundamental difference which makes it an SMT device being a second bend in the leads to flatten them parallel to the bottom plane ...