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  2. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323). TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. TO-3: Panel-mount with leads; TO-5: Metal can package with radial leads; TO-18: Metal can package with radial leads; TO-39; TO-46; TO-66: Similar shape to the TO-3 but smaller

  4. Small-outline transistor - Wikipedia

    en.wikipedia.org/wiki/Small-outline_transistor

    A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [ 1 ] SOT23-5 differs from SOT23 in a wider body of 1.6 mm (0.063 in) instead of 1.3 mm (0.051 in).

  5. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).

  6. 2N2222 - Wikipedia

    en.wikipedia.org/wiki/2N2222

    NPN silicon transistors with similar properties are also made in a variety of small through-hole and surface mount packages including TO-92, SOT-23, and SOT-223. Replacements for the 2N2222 are commonly available in the cheaper TO-92 packaging, where it is known as the PN2222 or P2N2222, which has similar specifications except for the lower ...

  7. Dual in-line package - Wikipedia

    en.wikipedia.org/wiki/Dual_in-line_package

    The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, [2] when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. [3]