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  2. Stone sealer - Wikipedia

    en.wikipedia.org/wiki/Stone_sealer

    Penetrating sealers often require the use of special cleaners which both clean and top up the repellent ingredient left on the stone surface. These sealers are often breathable to a certain degree, but do not penetrate deeply enough (generally less than 1mm) to be effective against salt attack, such as efflorescence and spalling.

  3. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France. Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer ...

  4. Buffered oxide etch - Wikipedia

    en.wikipedia.org/wiki/Buffered_oxide_etch

    Buffered oxide etch is commonly used for more controllable etching. [1] Buffering HF with NH 4 F results in a solution with a more stable pH; thus, more stable concentrations of HF and HF − 2, and a more stable etch rate. [2] Some oxides produce insoluble products in HF solutions.

  5. Dentine bonding agents - Wikipedia

    en.wikipedia.org/wiki/Dentine_bonding_agents

    All-in-one self-etch adhesive and a single component universal adhesive, used in the adhesion of direct and indirect dental restorations. Also known as a "bonderizer" bonding agents (spelled dentin bonding agents in American English) are resin materials used to make a dental composite filling material adhere to both dentin and enamel.

  6. Etching - Wikipedia

    en.wikipedia.org/wiki/Etching

    ferric chloride may be used for etching copper or zinc plates, whereas nitric acid may be used for etching zinc or steel plates. Typical solutions are 1 part FeCl 3 to 1 part water and 1 part nitric to 3 parts water. The strength of the acid determines the speed of the etching process. The etching process is known as biting (see also spit ...

  7. Isotropic etching - Wikipedia

    en.wikipedia.org/wiki/Isotropic_etching

    In semiconductor manufacturing, isotropic etching is a method commonly used to remove material from a substrate via a chemical process using an etchant substance. The etchant may be in liquid-, gas- or plasma -phase, [ 1 ] although liquid etchants such as buffered hydrofluoric acid (BHF) for silicon dioxide etching are more often used.

  8. FIFA's 90-second anthem rules has unintentionally created ...

    www.aol.com/news/2014-06-20-fifas-90-second...

    FIFA limits anthems to 90 seconds so they can get the World Cup games going quickly. But many national songs FIFA's 90-second anthem rules has unintentionally created some of the most emotional ...

  9. Reactive-ion etching - Wikipedia

    en.wikipedia.org/wiki/Reactive-ion_etching

    Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching . RIE uses chemically reactive plasma to remove material deposited on wafers .