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The most common heat pipe for electronics thermal management has a copper envelope and wick, with water as the working fluid. Copper/methanol is used if the heat pipe needs to operate below the freezing point of water, and aluminum/ammonia heat pipes are used for electronics cooling in space.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
Electronics cooling encompasses thermal design, analysis and experimental characterization of electronic systems as a discrete discipline with the product creation process for an electronics product, or an electronics sub-system within a product (e.g. an engine control unit (ECU) for a car).
Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock.
Immersion cooling is a promising thermal management technique to address these challenges. [26] Immersion cooling of batteries is specifically beneficial in abuse conditions, where the thermal propagation is needed to be avoided across the battery module or pack.
Various physical properties of semiconductor materials are temperature dependent. These include the diffusion rate of dopant elements, carrier mobilities and the thermal production of charge carriers. At the low end, sensor diode noise can be reduced by cryogenic cooling.
It describes the heating or cooling of a current-carrying conductor with a temperature gradient. If a current density J {\displaystyle \mathbf {J} } is passed through a homogeneous conductor, the Thomson effect predicts a heat production rate per unit volume.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).