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  2. Failure of electronic components - Wikipedia

    en.wikipedia.org/wiki/Failure_of_electronic...

    Electrostatic discharge (ESD) is a subclass of electrical overstress and may cause immediate device failure, permanent parameter shifts and latent damage causing increased degradation rate. It has at least one of three components, localized heat generation, high current density and high electric field gradient; prolonged presence of currents of ...

  3. Electrical fault - Wikipedia

    en.wikipedia.org/wiki/Electrical_fault

    In an electric power system, a fault or fault current is any abnormal electric current. For example, a short circuit is a fault in which a live wire touches a neutral or ground wire. An open-circuit fault occurs if a circuit is interrupted by a failure of a current-carrying wire (phase or neutral) or a blown fuse or circuit breaker.

  4. Overheating (electricity) - Wikipedia

    en.wikipedia.org/wiki/Overheating_(electricity)

    Circuit-breakers can be placed at portions of a circuit in series to the path of current it will affect. If more current than expected goes through the circuit-breaker, the circuit breaker "opens" the circuit and stops all current. A fuse is a common type of circuit breaker that involves direct effect of Joule-overheating.

  5. Intermittent fault - Wikipedia

    en.wikipedia.org/wiki/Intermittent_fault

    A simple example of an effectively random cause in a physical system is a borderline electrical connection in the wiring or a component of a circuit, where (cause 1, the cause that must be identified and rectified) two conductors may touch subject to (cause 2, which need not be identified) a minor change in temperature, vibration, orientation ...

  6. Conductive anodic filament - Wikipedia

    en.wikipedia.org/wiki/Conductive_anodic_filament

    CAF commonly occurs between adjacent vias (i.e. plated through holes) inside a PCB, as the copper migrates along the glass/resin interface from anode to cathode.CAF failures can manifest as current leakage, intermittent electrical shorts, and even dielectric breakdown between conductors in printed circuit boards. [3]

  7. Bent pin analysis - Wikipedia

    en.wikipedia.org/wiki/Bent_Pin_Analysis

    For example, a failure mode might be listed on the FMEA worksheet as “Pin A shorts Pin K,” and the corresponding local level failure effect might be “Input Signal X shorts Signal Y normal path.” (Here, bent Pin A carries Signal X and undamaged Pin K carries Signal Y.) Note that the failure mode “Pin A shorts Pin K” is very different ...

  8. Electrical safety testing - Wikipedia

    en.wikipedia.org/wiki/Electrical_safety_testing

    The maximum allowable patient leakage current is 500μA AC and 50μA DC in normal operation (normal condition, NC) and 1000μA AC or 100μA DC in single failure condition (SFC). [8] Requirements for the input stage. Temperature measurement and requirements. Printed circuit board (PCB) thickness requirements for multilayered boards.

  9. Worst-case circuit analysis - Wikipedia

    en.wikipedia.org/wiki/Worst-case_circuit_analysis

    In addition to a circuit analysis, a WCCA often includes stress and derating analysis, failure modes and effects criticality and reliability prediction . The specific objective is to verify that the design is robust enough to provide operation which meets the system performance specification over design life under worst-case conditions and ...