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Zen 5 CCDs are fabricated on TSMC's N4X node which is intended to accommodate higher frequencies for high-performance computing (HPC) applications. [18] Zen 4-based mobile processors were fabricated on the N4P node which is targeted more towards power efficiency.
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. [2] [3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. [4]
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]
Corsair expanded its DRAM memory module production into the high end market for overclocking. [8] This expansion allows for high power platforms and the ability to get more performance out of the CPU and RAM. The Corsair Vengeance Pro series and Corsair Dominator Platinum series are built for overclocking applications. [9] [10] [11]
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
Zen 5 series CPUs and APUs (released 2024) Granite Ridge Ryzen 9000 series (desktop) Strix Point Ryzen AI 300 series (laptop) Turin Epyc 9005 series (server)