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Intel Xeon E3-1241 v3 CPU, sitting atop the inside part of its retail box that contains an OEM fan-cooled heatsink Intel Xeon E3-1220 v3 CPU, pin side Introduced in May 2013, Xeon E3-12xx v3 is the first Xeon series based on the Haswell microarchitecture.
The following is a list of Intel Xeon microprocessors, by generation. Intel Xeon E5-1620, top and bottom. P6-based ... List of Intel Xeon processors.
HD Graphics P4600: Workstation: Xeon E3-1225 v3 Xeon E3-1226 v3 Xeon E3-1245 v3 Xeon E3-1246 v3: 350–1200 Xeon E3-1275 v3 Xeon E3-1276 v3: 350–1250 HD Graphics P4700: Workstation: Xeon E3-1285L v3 Xeon E3-1286L v3: 350–1250 Xeon E3-1285 v3 Xeon E3-1286 v3: 350–1300 HD Graphics 5000: ULT Mobile: Core i5-4250U: 0422 0426 042A 042B 042E ...
Support for up to 12 DIMMs of DDR4 memory per CPU socket; Xeon Platinum supports up to eight sockets; Xeon Gold supports up to four sockets; Xeon Silver and Bronze support up to two sockets; No suffix letter: up to 1.0TB DDR4 per socket-L: Large DDR memory tier support (up to 4.5TB)-M: Medium DDR memory tier support (up to 2.0TB)
28xx models support single- and dual-processor configurations, 48xx models support up to four-processor configurations, 88xx models support up to eight-processor configurations. Transistors: 2.6 billion; Die size: 513 mm²; Steppings: A2
All models support uni-processor configurations only. Intel HD Graphics P3000 uses drivers that are optimized and certified for professional applications, similar to Nvidia Quadro and AMD FirePro products. Die size: D2: 216 mm 2, Q0: 131 mm 2; Steppings: D2, Q0
The Xeon D was designed to offer better performance per watt compared to the Xeon E3 and better absolute performance compared to the Atom processors, while operating at lower power and higher densities than Xeon E5 processors. [2] Particularly, the Xeon D was designed to compete with emerging ARM microarchitecture–based server solutions, [3 ...
Support for up to 16 DIMMs of DDR4 memory per CPU socket, maximum 4 TB. Supports up to two sockets [1] PCI Express 4.0 lanes: 64-M: Media processing specialized-N: Network & NFV specialized-P: IaaS cloud specialized-Q: Liquid cooled-S: 512 GB SGX enclave per CPU-T: High thermal-case and extended reliability-U: Uniprocessor-V: SaaS cloud specialized