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Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. [ 1 ]
Versum Materials, Inc. is an American company that manufactures chemical-mechanical planarization slurries, ultra-thin dielectric and metal precursors of film, formulated cleans and etching products, and delivery equipment for the semiconductor industry. It is a subsidiary of Merck Group.
The principal industrial application of ceria is for polishing, especially chemical-mechanical planarization (CMP). [3] For this purpose, it has displaced many other oxides that were previously used, such as iron oxide and zirconia. For hobbyists, it is also known as "opticians' rouge". [20] [21]
SEMATECH and Cabot Microelectronics Collaborate to Accelerate Chemical Mechanical Planarization Technology for Future Devices ALBANY, N.Y.--(BUSINESS WIRE)-- SEMATECH today announced that Cabot ...
The key steps of the STI process involve etching a pattern of trenches in the silicon, depositing one or more dielectric materials (such as silicon dioxide) to fill the trenches, and removing the excess dielectric using a technique such as chemical-mechanical planarization. [2]
Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion resistance, tarnish resistance, chemical resistance, wear resistance, hardness, modify electrical conductivity, remove burrs and other surface flaws, and control the surface friction.
A thick coating of copper that significantly overfills the trenches is deposited on the insulator, and chemical-mechanical planarization (CMP) is used to remove the copper (known as overburden) that extends above the top of the insulating layer. Copper sunken within the trenches of the insulating layer is not removed and becomes the patterned ...
Chemical-mechanical polishing, a technique used in semiconductor fabrication; also known as planarization; Command Module Pilot, a position of the Apollo program crewed missions; Condensed matter physics, a branch of physics; Conjugated microporous polymer, a type of porous material; Cytidine monophosphate