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Electromigration (red arrow) is due to the momentum transfer from the electrons moving in a wire. Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms.
Stress migration is a failure mechanism that often occurs in integrated circuit metallization (aluminum, copper). Voids form as result of vacancy migration driven by the hydrostatic stress gradient. Large voids may lead to open circuit or unacceptable resistance increase that impedes the IC performance.
This still-relevant classical solution provides a foundation for modern problems in contact mechanics. For example, in mechanical engineering and tribology, Hertzian contact stress is a description of the stress within mating parts. The Hertzian contact stress usually refers to the stress close to the area of contact between two spheres of ...
Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
Feedback-controlled electromigration (FCE) is an experimental technique to investigate the phenomenon known as electromigration. By controlling the voltage applied as the conductance varies it is possible to keep the voltage at a critical level for electromigration .
Experimentally, stress relaxation is determined by step strain experiments, i.e. by applying a sudden one-time strain and measuring the build-up and subsequent relaxation of stress in the material (see figure), in either extensional or shear rheology. a) Applied step strain and b) induced stress as functions of time for a viscoelastic material.
Shear stress was then applied to the top and bottom surfaces of the Ni with a solute atom (Co, Ru, or Re) embedded at the center at 300 K. Previous studies have shown that the general view of size and modulus effects cannot fully explain the solid solution strengthening caused by Re in this system due to their small values. [19]
This type of stress may be called (simple) normal stress or uniaxial stress; specifically, (uniaxial, simple, etc.) tensile stress. [13] If the load is compression on the bar, rather than stretching it, the analysis is the same except that the force F and the stress σ {\displaystyle \sigma } change sign, and the stress is called compressive ...