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This is a guide to producing and using 3D models of real objects and environments for Wikimedia projects. 3D models are now supported on Wikimedia Commons, derivatives from 3D models including those using photogrammetry are also useful captured as images or videos: to show objects from directions it is not possible to take a photograph.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
Tinkercad is a free-of-charge, online 3D modeling program that runs in a web browser. [1] Since it became available in 2011 it has become a popular platform for creating models for 3D printing as well as an entry-level introduction to constructive solid geometry in schools.
Tungsten carbide (chemical formula: WC) is a chemical compound (specifically, a carbide) containing equal parts of tungsten and carbon atoms. In its most basic form, tungsten carbide is a fine gray powder, but it can be pressed and formed into shapes through sintering [7] for use in industrial machinery, engineering facilities, [8] molding blocks, [9] cutting tools, chisels, abrasives, armor ...
3DFlow, srl is an Italian software house operating in the field of Computer Vision and Image Processing.It was established in 2011 as a spin-off of the University of Verona and in 2012 it became a spin-off of the University of Udine.
Computer-aided design (CAD) model used for 3D printing. The manual modeling process of preparing geometric data for 3D computer graphics is similar to plastic arts such as sculpting. 3D scanning is a process of collecting digital data on the shape and appearance of a real object, creating a digital model based on it.
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