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ATmega328P in 28-pin narrow dual in-line package (DIP-28N) ATmega328P in 32-pin thin quad flat pack (TQFP-32) Die of ATmega328P. The ATmega328 is a single-chip microcontroller created by Atmel in the megaAVR family (later Microchip Technology acquired Atmel in 2016). It has a modified Harvard architecture 8-bit RISC processor core.
Atmega328P-PU Universal Solder (universal-solder.com) Do-it-yourself Arduino Uno R3 compatible footprint and connections. Additional features: 5 V, 1.5 A LDO voltage regulator with heat sink; 3.3 V, 250 mA LDO voltage regulator; 6 to 35 V DC power supply; LEDs and voltage regulator can be disabled to save on current
ATmega328P A combination of an ATmega328P and an I 2 C based RGB backlit LCD interface (software compatible with the Adafruit RGB LCD shield), along with a USB serial programming interface done as a "backpack" module for the LCD. LEDuino [172] A board with enhanced I 2 C, DCC decoder and CAN-bus interfaces. Manufactured using surface mount and ...
The Arduino Nano is an open-source breadboard-friendly microcontroller board based on the Microchip ATmega328P microcontroller (MCU) and developed by Arduino.cc and initially released in 2008. It offers the same connectivity and specs of the Arduino Uno board in a smaller form factor.
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But instead of continuing the work on Wiring, they forked the project and renamed it Arduino. Early Arduino boards used the FTDI USB-to-UART serial chip and an ATmega168. [10] The Uno differed from all preceding boards by featuring the ATmega328P microcontroller and an ATmega16U2 (Atmega8U2 up to version R2) programmed as a USB-to-serial converter.
In electronic logic circuits, a pull-up resistor (PU) or pull-down resistor (PD) is a resistor used to ensure a known state for a signal. [1] It is typically used in combination with components such as switches and transistors , which physically interrupt the connection of subsequent components to ground or to V CC .
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.