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Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Sn100C, a lead-free silver-free nickel-stabilized alloy. Similar to Sn99Cu1. The nickel content lowers copper erosion and promotes shiny solder fillet. The presence of germanium promotes flow and reduces dross formation. Performance similar to SAC alloys at lower cost. Dross formation rate comparable to lead-tin alloys. Sn 99 Sb 1: 232: 235 [93 ...
Cerrosafe is a fusible alloy with a low melting point.It is a non-eutectic mixture consisting of 42.5% bismuth, 37.7% lead, 11.3% tin, and 8.5% cadmium that melts between 70 °C (158 °F) and 88 °C (190 °F).
The Platinum Metals and their Alloys. New York: The International Nickel Company, Inc., 1941: 16. — "Values ranging from 21.3 to 21.5 gm/cm 3 at 20 °C have been reported for the density of annealed platinum; the best value being about 21.45 gm/cm 3 at 20 °C." 21.46 g/cm 3 — Rose, T. Kirke. The Precious Metals, Comprising Gold, Silver and ...
This new trend increased the need to understand the behavior of lead-free solders. Much work has been done to characterize the creep-fatigue behavior of various solder alloys and develop predictive life damage models using a Physics of Failure approach. These models are often used when trying to assess solder joint reliability.
Leaded copper is a metal alloy of copper with lead. A small amount of lead makes the copper easier to machine. Alloys with a larger amount of lead are used for bearings. Brass and bronze alloys of copper may have lead added and are then also sometimes referred to as leaded copper alloys. [1] Leaded copper and its alloys have been used since ...
Solderability varies depending on the type of solder alloy under discussion. The discussion that follows applies only to unspecified electronic solders [2] (which may include solders that contain lead, now banned for use in nearly all electronic equipment made or sold in the EU). Solderability when using lead-free alloys can differ ...
No attempt is made to correct for materials whose stiffness varies with their density. Material Young's modulus Density (g/cm 3) Young's modulus per density; specific stiffness (10 6 m 2 s −2) Young's modulus per density squared (10 3 m 5 kg −1 s −2) Young's modulus per density cubed (m 8 kg −2 s −2) Reference Latex foam, low density ...