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A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm.
SOIC-16 A PIC microcontroller (wide SOIC-28) in a ZIF socket. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
The fully redesigned z990 mainframes for the mid-range and high-end became available in June and October 2003, respectively. [40] Featuring IBM's first superscalar CMOS mainframe processors, a dual-core chip contained 121 million transistors across 266 mm 2, and was manufactured in a 130 nm process, drawing 55 Watts at 1.2 GHz in the z990. [41]
Trim/appearance package: May include special paint colors, upgraded interior trim pieces (often made from aluminum, chrome or timber), and exterior decals. In past decades, appearance packages have also included two-tone paint, pin striping , bumpers painted the same color as the vehicle body, and vinyl roof covers.
Comparison between the E-Line/Miniplast package and the TO-92 package In the late 1960s, Ferranti introduced a smaller package with a compatible footprint, called "E-Line". [ 4 ] [ 5 ] This package was later standardized as a British Standard (but not by JEDEC) and remained in production with Ferranti Semiconductors' successor companies ...
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